Title: Emerging Opportunities in Semiconductor Post-Processing: A Technological Landscape

In recent years, the semiconductor manufacturing industry has witnessed a significant expansion of opportunities in the post-processing phase, driven by the thriving artificial intelligence (AI) market. The implementation of new packaging technologies, such as the "Chiplet" approach, which involves handling multiple semiconductors as a single chip, has accelerated, bringing forth novel practical applications downstream. As the complexity of post-processing technology increases, there is a parallel expectation of a surge in material demand.

Chemical manufacturers are leveraging their expertise in materials from the preceding stages to propose cross-disciplinary technological solutions for post-processing. The focus is on adapting techniques developed for front-end materials to cater to the demands of the post-processing phase, with a keen eye on gaining market share. The article highlights the efforts of key players such as SUMCO, FujiFilm, and JSR in reinforcing their technological proposals.
Semiconductor manufacturing has shifted its attention to post-processing implementation technologies that promise performance improvements without relying solely on circuit miniaturization. Advanced semiconductors, especially those designed for AI applications, utilize the "Chiplet" technology, where circuits previously integrated on a single chip are fragmented and interconnected across multiple chips. The technology's significant feature lies in connecting multiple chips and wiring boards through interposers like silicon or organic substrates.

SUMCO, a leading silicon wafer manufacturer, anticipates a surge in demand for high-performance silicon substrates as interposers. This is driven by the need for efficient interconnection between multiple chips, resulting in a doubling of wafer consumption compared to traditional technologies. The enlargement of packages due to the configuration of multiple chips is expected to increase material usage. Additionally, the shift to a different implementation process necessitates materials with new functionalities.

FujiFilm has recently initiated mass production of Chemical Mechanical Polishing (CMP) slurries tailored for post-processing. CMP slurries are abrasive materials designed to uniformly polish semiconductor surfaces with varying hardness in wiring and insulating films. The new material is primarily used to flatten the "re-wiring layer" that connects semiconductor chips and wiring boards. Leveraging its expertise in CMP slurries for copper wiring, the company aims to capitalize on the expanding demand, driven by the narrowing wiring pitch and the need for flattening during chip stacking.

JSR, on the other hand, is developing photosensitive insulation materials, specifically polyimide (PI), for applications in re-wiring layers. With a focus on reliability and the demand for various characteristics like high resolution and warp suppression, JSR aims to introduce these materials to the market in the coming years. By diversifying its portfolio to include various implementation materials, JSR aims to address the evolving demands of the post-processing phase comprehensively.

Against the backdrop of increased demand for AI semiconductors, major semiconductor companies are intensifying their efforts in post-processing enhancement. Taiwan Semiconductor Manufacturing Company (TSMC) has announced plans to double its production capacity for advanced packaging by the end of 2024, while Samsung Electronics is establishing a new facility in Yokohama, emphasizing the strengthening of post-processing research and development capabilities.

Industry insiders predict that the challenges posed by next-generation technologies such as Chiplets and 3D stacking are significant, leading semiconductor manufacturers to consider internalizing post-processing efforts. This potential shift in dynamics could create new opportunities in the post-processing domain for suppliers, depending on the strategies adopted by manufacturers.

In conclusion, the semiconductor industry is experiencing a paradigm shift with the growing importance of post-processing technologies. The interplay of material innovation, technological adaptation, and market dynamics presents a landscape ripe with opportunities for those positioned to navigate the complexities of this evolving sector.